Failure analysts often use scanning acoustic microscopes to image flip-chip features such as underfill voids, delaminations, and disbonded solder bumps. As designers have decreased the size of IC ...

The semiconductor manufacturing industry is seeing a dramatic increase in the demand for probe-mark inspection, driven primarily by the introduction of multiple die packages, the adoption of new ...

The rising cost and complexity of developing chips at the most advanced nodes is forcing many chipmakers to begin breaking up that chip into multiple parts, not all of which require leading edge nodes ...

Editor’s preface: There is increasing interest in the ‘new’ smart card chip manufacturing technique known as Flip Chip. An alternative to the tradional manufacturing process that attached chips to ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

Fundamental materials properties of the plated layer (such as purity and microstructure) are critical for die attach and wirebond, and the specific plating strategies that can yield these properties.