Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

Choose the best answer: 1. What size copper bonding jumper (BJ) should you use to bond/ground the secondary of a separately derived system to building steel? The circuit has four No. 3/0 THWN copper ...

Fort Washington, Pa. — Kulicke & Soffa Industries, Inc. has released a new gold wire for stacked-die and multi-layer applications, and an ultra-soft copper wire for a variety of discrete and IC ...

But gold prices have jumped by a whopping 200 percent in recent times, prompting many (but not all) chip makers to switch gears and move towards wirebonding using copper wiring–and for good reason. By ...

The rising cost and complexity of developing chips at the most advanced nodes is forcing many chipmakers to begin breaking up that chip into multiple parts, not all of which require leading edge nodes ...