The Bull brand, regrouping Atos Group’s Advanced Computing and AI activities, was officially launched on January 29, 2026, bringing back a historically rooted technology name. Bull is a global leader ...
A new technical paper titled “relOBI: A Reliable Low-latency Interconnect for Tightly-Coupled On-chip Communication” was published by researchers at ETH Zurich. “On-chip communication is a critical ...
[CONTRIBUTED THOUGHT PIECE] Data centers are in the midst of a rapid transformation to support the increasing number, complexity and size of AI and HPC workloads. As part of that transformation, large ...
SUNNYVALE, Calif. & YOKNEAM, Israel--(BUSINESS WIRE)--Mellanox® Technologies, Ltd. (NASDAQ: MLNX)(TASE: MLNX), a leading supplier of high-performance, end-to-end interconnect solutions for data center ...
A new technical paper titled “On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach” was published by researchers at ...
AMD's desktop Ryzen processors with more than 8 cores are fabricated using chiplets: one big die handles memory, I/O, and other functions, while smaller dice called "CCDs" contain the Zen CPU cores.
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